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Internal stress evaluation method of the silicon carbide single crystal wafer, and the prediction method of the warping of the silicon carbide single crystal wafer
Internal stress evaluation method of the silicon carbide single crystal wafer, and the prediction method of the warping of the silicon carbide single crystal wafer
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机译:碳化硅单晶晶片的内应力评估方法以及碳化硅单晶晶片翘曲的预测方法
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摘要
Provided are a method of evaluating an internal stress of a silicon carbide (SiC) single crystal wafer and a method of predicting warpage of the SiC single crystal wafer after completion of polishing by evaluating the internal stress of the wafer. Wavenumber shift amounts of Raman-scattered light are measured at two points within a surface of the SiC single crystal wafer, and the internal stress is evaluated through use of a difference between the wavenumber shift amounts. Also provided is a method of predicting warpage of a silicon carbide single crystal wafer in advance, the silicon carbide single crystal wafer being produced by a sublimation-recrystallization method, the method including predicting warpage of a SiC single crystal wafer through use of the evaluation indicator.
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