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Adhesive strength measuring device and the adhesive strength measurement method

机译:粘合强度测量装置和粘合强度测量方法

摘要

PROBLEM TO BE SOLVED: To provide an adhesive strength measuring apparatus in which measurement precision can be improved, and an adhesive strength measuring method.;SOLUTION: An adhesive strength measuring apparatus 1 which measures an adhesive strength of an adhesion member W adhered to an adhered surface T1 of an adhered body T comprises pressing means which presses a corner portion W1 of the adhesion member W in a direction parallel to the adhered surface T1 and toward a proximal end side of the corner portion W1, load measuring means which measures a load caused by pressing, and adhesive strength output means which outputs a maximum load measured by the load measuring means.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种可以提高测量精度的粘合强度测量设备以及粘合强度测量方法。解决方案:粘合强度测量设备1,其测量粘附在被粘物上的粘合构件W的粘合强度。粘附体T的表面T1包括在与粘附表面T1平行的方向上并且朝向拐角部分W1的近端侧挤压粘附构件W的拐角部分W1的挤压装置,测量引起的载荷的载荷测量装置。压接和粘合强度输出装置,输出由负载测量装置测得的最大负载。;版权所有:(C)2013,JPO&INPIT

著录项

  • 公开/公告号JP5848952B2

    专利类型

  • 公开/公告日2016-01-27

    原文格式PDF

  • 申请/专利权人 リンテック株式会社;

    申请/专利号JP20110240185

  • 发明设计人 佐伯 尚哉;賤機 弘憲;

    申请日2011-11-01

  • 分类号G01N3/00;G01N19/04;

  • 国家 JP

  • 入库时间 2022-08-21 14:40:44

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