首页> 外国专利> INTEGRATED CIRCUIT STRUCTURES WITH SPIN TORQUE TRANSFER MAGNETIC RANDOM ACCESS MEMORY HAVING INCREASED MEMORY CELL DENSITY AND METHODS FOR FABRICATING THE SAME

INTEGRATED CIRCUIT STRUCTURES WITH SPIN TORQUE TRANSFER MAGNETIC RANDOM ACCESS MEMORY HAVING INCREASED MEMORY CELL DENSITY AND METHODS FOR FABRICATING THE SAME

机译:具有自旋扭矩传递磁性随机访问存储器的集成电路结构,其存储器单元密度增加,并且制造方法相同

摘要

STT-MRAM integrated circuit and method for fabricating the same are disclosed. An integrated circuit includes a word line layer, a bit line layer, and an MRAM stack in contact with the bit line metal layer. The integrated circuit further includes a first doped silicon layer in contact with the MRAM stack, the first doped silicon layer including conductivity-determining ions of a first type, and a second doped silicon layer in contact with the first doped silicon layer and further in contact with the word line layer, the second doped silicon layer including conductivity-determining ions of a second type that is opposite the first type. Still further, the integrated circuit includes a third doped silicon layer in contact with the second doped silicon layer and a source line layer in electrical contact with the third doped silicon layer.
机译:公开了STT-MRAM集成电路及其制造方法。集成电路包括字线层,位线层和与位线金属层接触的MRAM叠层。该集成电路还包括与MRAM堆栈接触的第一掺杂硅层,该第一掺杂硅层包括第一类型的电导率确定离子,以及与该第一掺杂硅层接触并进一步接触的第二掺杂硅层。通过字线层,第二掺杂硅层包括与第一类型相反的第二类型的电导率确定离子。更进一步,集成电路包括与第二掺杂硅层接触的第三掺杂硅层和与第三掺杂硅层电接触的源极线层。

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