首页> 外国专利> GALVANIC PROCESS FOR FILLING THROUGH-HOLES WITH METALS, IN PARTICULAR OF PRINTED CIRCUIT BOARDS WITH COPPER

GALVANIC PROCESS FOR FILLING THROUGH-HOLES WITH METALS, IN PARTICULAR OF PRINTED CIRCUIT BOARDS WITH COPPER

机译：用金属填充通孔的过程，特别是用铜印刷的电路板

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摘要

The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper.

机译：本发明涉及一种用金属填充通孔的电镀方法。该方法特别适合于用铜填充印刷电路板的通孔。

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公开/公告号US2016270241A1

专利类型
公开/公告日2016-09-15

原文格式PDF
申请/专利权人 ATOTECH DEUTSCHLAND GMBH;
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申请/专利号US201615159943
发明设计人 RENE WENZEL;THOMAS PLIET;BERND ROELFS;MARKUS YOUKHANIS;BERT REENTS;SOUNGSOO KIM;TOSHIYA FUJIWARA;
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申请日2016-05-20
分类号H05K3/42;H05K1/11;
国家 US
入库时间 2022-08-21 14:38:31

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