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COPPER MATERIAL FOR HIGH-PURITY COPPER SPUTTERING TARGET, AND HIGH-PURITY COPPER SPUTTERING TARGET
COPPER MATERIAL FOR HIGH-PURITY COPPER SPUTTERING TARGET, AND HIGH-PURITY COPPER SPUTTERING TARGET
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机译:用于高纯度铜溅射靶材的铜材料和用于高纯度铜溅射靶材的铜
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摘要
In a copper material for a high-purity copper sputtering target of the present invention, a purity of Cu excluding O, H, N, and C is in a range of 99.999980 mass % or higher and 99.999998 mass % or lower, an amount of Al is 0.005 ppm by mass or less, and an amount of Si is 0.05 ppm by mass or less.
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