SUBSTRATE CONTAINING LOW-Dk-CORE GLASS FIBERS HAVING LOW DIELECTRIC CONSTANT (Dk) CORES FOR USE IN PRINTED CIRCUIT BOARDS (PCBs), AND METHOD OF MAKING SAME

摘要

An enhanced substrate for printed circuit board (PCBs) includes the low Dk- core glass fiber with low dielectric constant (Dk) core. In some embodiments, low Dk- core glass fiber is by a low Dk fluids, such as a kind of gas (such as air, nitrogen and/or an inert gas) or a kind of filling of liquid. After through-hole is in the substrate drilling or is otherwise formed, the end that silane is applied in hollow glass fibre exposed in through-holes seals low Dk fluids within the core of hollow glass fibre. In some embodiments, low Dk- core glass fiber is filled by a kind of solid (for example, a low Dk resins). For example, a hollow glass fibre can be provided, it is then filled with the low Dk resins in a liquid. Then low Dk resins within hollow glass fibre are cured with a solid-state.