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EMBEDDED DRAM IN REPLACEMENT METAL GATE TECHNOLOGY

机译:嵌入式金属门技术中的嵌入式DRAM

摘要

Methods for forming an eDRAM with replacement metal gate technology and the resulting device are disclosed. Embodiments include forming first and second dummy electrodes on a substrate, each dummy electrode having spacers at opposite sides and being surrounded by an ILD; removing the first and second dummy electrodes, forming first and second cavities, respectively; forming a hardmask over the substrate, exposing the first cavity; forming a deep trench in the substrate through the first cavity; removing the hardmask; and forming a capacitor in the first cavity and deep trench and concurrently forming an access transistor in the second cavity.
机译:公开了利用替代金属栅极技术形成eDRAM的方法和所得器件。实施例包括在基板上形成第一和第二虚设电极,每个虚设电极在相对侧具有隔离物并且被ILD包围;去除第一虚设电极和第二虚设电极,分别形成第一空腔和第二空腔。在基板上形成硬掩模,露出第一空腔;穿过第一腔体在基板中形成深沟槽;去除硬掩模;在第一腔和深沟槽中形成电容器,并在第二腔中同时形成存取晶体管。

著录项

  • 公开/公告号US2016126245A1

    专利类型

  • 公开/公告日2016-05-05

    原文格式PDF

  • 申请/专利权人 GLOBALFOUNDRIES INC.;

    申请/专利号US201414527278

  • 发明设计人 MIN-HWA CHI;YANXIANG LIU;

    申请日2014-10-29

  • 分类号H01L27/108;H01L21/308;H01L21/3065;

  • 国家 US

  • 入库时间 2022-08-21 14:34:12

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