首页> 外国专利> THIN OXIDE FORMATION BY WET CHEMICAL OXIDATION OF SEMICONDUCTOR SURFACE WHEN THE ONE COMPONENT OF THE OXIDE IS WATER SOLUBLE

THIN OXIDE FORMATION BY WET CHEMICAL OXIDATION OF SEMICONDUCTOR SURFACE WHEN THE ONE COMPONENT OF THE OXIDE IS WATER SOLUBLE

机译:当氧化物的一种成分可溶于水时,通过半导体表面的湿式化学氧化形成稀氧化物

摘要

A semiconductor device is provided, which comprises a semiconductor structure having a surface, the semiconductor structure comprising a material whose oxide is water soluble; and an oxide layer formed on the surface of the semiconductor structure by a wet chemical oxidation treatment utilizing a solvent mixture that comprises a water soluble substance and an aprotic solvent. The layer of oxide may be as thin as approximately 0.7 nanometers in width or less. The semiconductor structure comprises at least one of Ge, SiGe, and III-V compound semiconductor materials. A solution mixture for oxidizing selective semiconductor materials is also provided, which comprises a solvent mixture that includes: a water soluble oxidizing agent; and an aprotic solvent.
机译:提供一种半导体器件,该半导体器件包括具有表面的半导体结构,该半导体结构包括氧化物是水溶性的材料;通过使用包含水溶性物质和非质子溶剂的溶剂混合物通过湿化学氧化处理在半导体结构的表面上形成的氧化物层。氧化物层的厚度可以薄至大约0.7纳米或更小。半导体结构包括Ge,SiGe和III-V族化合物半导体材料中的至少一种。还提供了一种用于氧化选择性半导体材料的溶液混合物,其包括溶剂混合物,该溶剂混合物包括:水溶性氧化剂;和和非质子溶剂。

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