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Methods of removing residual polymers formed during a boron-doped amorphous carbon layer etch process

机译:去除在掺硼非晶碳层蚀刻过程中形成的残留聚合物的方法

摘要

Methods for removing residual polymers formed during etching of a boron-doped amorphous carbon layer are provided herein. In some embodiments, a method of etching a feature in a substrate includes: exposing a boron doped amorphous carbon layer disposed on the substrate to a first plasma through a patterned mask layer to etch a feature into the boron doped amorphous carbon layer, wherein the first plasma is formed from a first process gas that reacts with the boron doped amorphous carbon layer to form residual polymers proximate a bottom of the feature; and exposing the residual polymers to a second plasma through the patterned mask layer to etch the residual polymers proximate the bottom of the feature, wherein the second plasma is formed from a second process gas comprising nitrogen (N2), oxygen (O2), hydrogen (H2), and methane (CH4).
机译:本文提供了去除在蚀刻硼掺杂的非晶碳层期间形成的残留聚合物的方法。在一些实施例中,一种蚀刻衬底中的特征的方法包括:通过图案化的掩模层将设置在衬底上的硼掺杂的非晶碳层暴露于第一等离子体,以将特征蚀刻到硼掺杂的非晶碳层中,其中第一等离子体由第一处理气体形成,该第一处理气体与掺杂硼的非晶碳层反应以形成靠近特征底部的残留聚合物;并通过图案化的掩模层将残余聚合物暴露于第二等离子体,以蚀刻特征底部附近的残余聚合物,其中第二等离子体由包含氮气(N 2 )的第二处理气体形成。 ,氧(O 2 ),氢(H 2 )和甲烷(CH 4 )。

著录项

  • 公开/公告号US9390923B2

    专利类型

  • 公开/公告日2016-07-12

    原文格式PDF

  • 申请/专利权人 APPLIED MATERIALS INC.;

    申请/专利号US201414324000

  • 申请日2014-07-03

  • 分类号H01L21/302;H01L21/033;H01L21/3065;H01L21/32;

  • 国家 US

  • 入库时间 2022-08-21 14:32:43

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