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Alternative 3D stacking scheme for DRAMs atop GPUs
Alternative 3D stacking scheme for DRAMs atop GPUs
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机译:GPU上的DRAM的替代3D堆叠方案
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摘要
Embodiments of the invention provide an integrated circuit system, which includes a first supporting substrate and a second supporting substrate, a logic chip disposed between the first supporting substrate and the second supporting substrate, and a plurality of memory stacks disposed adjacent to one another on a surface of the logic chip. The logic chip is separated from the first supporting substrate and the second supporting substrate by a distance such that at least a portion of a first memory stack in the plurality of memory stacks extending outwards past a first side edge of the logic chip is supported by the first supporting substrate, and at least a portion of a second memory stack in the plurality of memory stacks extending outwards past a second side edge of the logic chip that is opposite to the first side edge is supported by the second supporting substrate.
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