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Power semiconductor device with dual field plate arrangement and method of making

机译:具有双场板布置的功率半导体器件及其制造方法

摘要

A semiconductor device includes a semiconductor layer, gate electrodes, an insulating film, source electrodes, and drain electrodes which are provided on the semiconductor layer. Each of the source electrodes and the drain electrodes are spaced in the insulating film from a corresponding gate electrode, such that one end thereof is in contact with the semiconductor layer and the other end thereof is exposed. Further, the semiconductor device includes first field plate electrodes, each of which is provided on a corresponding gate electrode and the insulating film, and second field plate electrodes, each of which is provided on the insulating film between a corresponding first field plate electrode and a corresponding drain electrode. Furthermore, the thickness of the insulating film between each first field plate electrode and the semiconductor layer is smaller than the thickness of the insulating film between each second field plate electrode and the semiconductor layer.
机译:半导体器件包括设置在半导体层上的半导体层,栅电极,绝缘膜,源电极和漏电极。源电极和漏电极中的每一个在绝缘膜中与对应的栅电极间隔开,使得其一端与半导体层接触并且其另一端暴露。此外,该半导体器件包括第一场板电极和第二场板电极,每个第一场板电极设置在相应的栅电极和绝缘膜上,第二场板电极分别在绝缘膜上设置在相应的第一场板电极和绝缘膜之间。相应的漏电极。此外,每个第一场板电极与半导体层之间的绝缘膜的厚度小于每个第二场板电极与半导体层之间的绝缘膜的厚度。

著录项

  • 公开/公告号US9318565B2

    专利类型

  • 公开/公告日2016-04-19

    原文格式PDF

  • 申请/专利权人 KABUSHIKI KAISHA TOSHIBA;

    申请/专利号US201414474051

  • 发明设计人 HITOSHI KOBAYASHI;

    申请日2014-08-29

  • 分类号H01L29/40;H01L27/088;H01L21/8234;H01L21/3213;H01L29/417;H01L29/80;H01L29/49;H01L29/778;H01L29/20;

  • 国家 US

  • 入库时间 2022-08-21 14:31:34

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