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Packaged capacitor component with multiple self-resonance frequencies

机译:具有多个自谐振频率的封装电容器组件

摘要

A packaged capacitor component such as a surface mount technology capacitor component may be formed with multiple self-resonant frequencies. The capacitor component may include multiple capacitor portions separated by dielectric layers. The capacitor portions may each be formed from interleaving conductive layers. Additional dielectric layers may be interposed between the interleaving conductive layers. Each capacitor portion may be characterized by a corresponding self-resonance frequency. If desired, a packaged capacitor component having multiple self-resonant frequencies may be formed by stacking multiple surface-mount capacitor components. Each of the stacked surface-mount capacitor components may include interleaving conductive layers that are centered between top and bottom surfaces of that component. Packaged capacitor components having multiple self-resonance frequencies may be used as direct-current blocking capacitors or decoupling capacitors.
机译:诸如表面安装技术电容器组件之类的封装电容器组件可以形成为具有多个自谐振频率。电容器组件可以包括被电介质层分开的多个电容器部分。每个电容器部分可以由交织的导电层形成。可以在交错的导电层之间插入附加的介电层。每个电容器部分可以通过相应的自谐振频率来表征。如果需要,可以通过堆叠多个表面安装电容器组件来形成具有多个自谐振频率的封装电容器组件。每个堆叠的表面安装电容器组件可包括位于该组件的顶表面和底表面之间居中的交错导电层。具有多个自谐振频率的封装电容器组件可以用作直流阻断电容器或去耦电容器。

著录项

  • 公开/公告号US9398683B2

    专利类型

  • 公开/公告日2016-07-19

    原文格式PDF

  • 申请/专利权人 APPLE INC.;

    申请/专利号US201313850756

  • 发明设计人 DAVID FIFIELD;

    申请日2013-03-26

  • 分类号H01G4/228;H05K1/02;H01G4/38;H01G4/40;H01G4/012;H05K1/18;

  • 国家 US

  • 入库时间 2022-08-21 14:31:11

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