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High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same

机译:高强度,高导电率的铜合金压延板及其制造方法

摘要

In a high-strength and high-electrical conductivity copper alloy rolled sheet, 0.14 to 0.34 mass % of Co, 0.046 to 0.098 mass % of P, 0.005 to 1.4 mass % of Sn are contained, [Co] mass % representing a Co content and [P] mass % representing a P content satisfy the relationship of 3.0≦([Co]−0.007)/([P]−0.009)≦5.9, a total cold rolling ratio is equal to or greater than 70%, a recrystallization ratio is equal to or less than 45% a an average grain size of recrystallized grains is in the range of 0.7 to 7 μm, an average grain diameter of precipitates is in the range of 2.0 to 11 nm, and an average grain size of fine crystals is in the range of 0.3 to 4 μm. By the precipitates of Co and P, the solid solution of Sn, and fine crystals, the strength, conductivity and ductility of the copper alloy rolled sheet are improved.
机译:在高强度高导电率的铜合金压延板中,含有0.14〜0.34质量%的Co,0.04〜0.098质量%的P,0.005〜1.4质量%的Sn,[Co]质量%表示Co的含量。表示P含量的[P]质量%满足3.0≤([Co] -0.007)/([P] -0.009)≤5.9的关系,总冷轧率为70%以上,重结晶比率等于或小于45%;重结晶晶粒的平均粒径在0.7至7μm的范围内;沉淀物的平均粒径在2.0至11nm的范围内;细晶粒的平均粒径晶体在0.3至4μm的范围内。通过Co和P的析出物,Sn的固溶体和微细的晶体,铜合金压延板的强度,导电性和延展性得以提高。

著录项

  • 公开/公告号US9455058B2

    专利类型

  • 公开/公告日2016-09-27

    原文格式PDF

  • 申请/专利权人 KEIICHIRO OISHI;

    申请/专利号US200913144057

  • 发明设计人 KEIICHIRO OISHI;

    申请日2009-12-25

  • 分类号C22C9/02;C22F1/08;H01B1/02;C22C9/06;

  • 国家 US

  • 入库时间 2022-08-21 14:30:29

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