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Common die for supporting different external memory types with minimal packaging complexity
Common die for supporting different external memory types with minimal packaging complexity
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机译:通用芯片,用于以最小的封装复杂度支持不同的外部存储器类型
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摘要
A configurable die including a logic element configured to communicate a control and address (CA) signal and a data (DQ) signal, and a first generic physical interface (PHY) and a second generic PHY in communication with the logic element, wherein each of the first generic PHY and the second generic PHY is configurable as a CA PHY and as a DQ PHY, and wherein the logic element is configurable to communicate the CA signal and the DQ signal to different ones of the first and second generic PHYs.
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