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A COMMON DIE FOR SUPPORTING DIFFERENT EXTERNAL MEMORY TYPES WITH MINIMAL PACKAGING COMPLEXITY
A COMMON DIE FOR SUPPORTING DIFFERENT EXTERNAL MEMORY TYPES WITH MINIMAL PACKAGING COMPLEXITY
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机译:一个通用的模具,用于支持具有最小包装复杂性的不同外部存储器类型
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摘要
A configurable die including a logic element configured to communicate a control and address (CA) signal and a data (DQ) signal, and a first generic physical interface (PHY) and a second generic PHY in communication with the logic element, wherein each of the first generic PHY and the second generic PHY is configurable as a CA PHY and as a DQ PHY, and wherein the logic element is configurable to communicate the CA signal and the DQ signal to different ones of the first and second generic PHYs.
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