embedded image "/> Quaternary phosphonium salt, epoxy resin composition for encapsulating semiconductor device and including the quaternary phosphonium salt, and semiconductor device encapsulated with the epoxy resin composition
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Quaternary phosphonium salt, epoxy resin composition for encapsulating semiconductor device and including the quaternary phosphonium salt, and semiconductor device encapsulated with the epoxy resin composition

机译:季phospho盐,用于封装半导体器件并包括该季phospho盐的环氧树脂组合物以及用该环氧树脂组合物封装的半导体器件

摘要

A quaternary phosphonium salt, an epoxy resin composition including the quaternary phosphonium salt, and a semiconductor device encapsulated with the epoxy resin composition, the quaternary phosphonium salt being represented by Formula 1:; embedded image
机译:季phospho盐,包括该季phospho盐的环氧树脂组合物,以及用该环氧树脂组合物封装的半导体器件,该季phospho盐由式1表示; “嵌入式图像”

著录项

  • 公开/公告号US9428632B2

    专利类型

  • 公开/公告日2016-08-30

    原文格式PDF

  • 申请/专利权人 MIN GYUM KIM;SEUNG HAN;HWAN SUNG CHEON;

    申请/专利号US201314069564

  • 发明设计人 MIN GYUM KIM;SEUNG HAN;HWAN SUNG CHEON;

    申请日2013-11-01

  • 分类号C08L63;H01L23/29;H01L23/28;C08G59;C08G59/68;C09D163;C07F9/54;C08K5/50;C08K5/5419;C08G59/08;C08G59/62;

  • 国家 US

  • 入库时间 2022-08-21 14:30:10

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