Quaternary phosphonium salt, epoxy resin composition for encapsulating semiconductor device including the quaternary phosphonium salt and semiconductor device encapsulated with the epoxy resin composition

摘要

Disclosed herein is an epoxy resin composition for encapsulating a semiconductor device. The epoxy resin composition includes an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler. The curing accelerator includes a quaternary phosphonium salt of Formula 1: wherein R 1 , R 2 , R 3 , and R 4 are each independently a substituted or unsubstituted C 1 -C 30 hydrocarbon group, or a substituted or unsubstituted C 1 -C 30 hydrocarbon group including at least one heteroatom; X is a substituted or unsubstituted C 1 -C 30 hydrocarbon group, or a substituted or unsubstituted C 1 -C 30 hydrocarbon group including at least one heteroatom; Y is a substituted or unsubstituted C 1 -C 30 hydrocarbon group, or Si substituted with one to three substituted or unsubstituted C 1 -C 30 hydrocarbon groups; n and m are each independently an integer from 1 to 6; 1 is a number greater than 0 to 6, provided that when Y is Si, the sum of m and the number of the substituents is a maximum of 4. The epoxy resin composition has good room temperature storage stability, sufficient flowability upon curing, and high curability. Examples for salts according to the application are: