首页>
外国专利>
Semiconductor device having lead frame with notched inner leads
Semiconductor device having lead frame with notched inner leads
展开▼
机译:具有带凹口内部引线的引线框架的半导体器件
展开▼
页面导航
摘要
著录项
相似文献
摘要
A semiconductor device is assembled from a lead frame. The device has a semiconductor die mounted on a flag of the lead frame. A mold compound forms a housing that covers the die. Lead fingers surround the die. Each lead finger has an inner lead length that is covered by the housing and an outer lead length that protrudes from the housing. The inner lead length extends from an edge of the housing towards the die. The inner lead length has an intermediate region that has been bent to form a notch. Bond wires electrically connect electrodes of the die to respective inner lead lengths.
展开▼