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Semiconductor device including alternating source and drain regions, and respective source and drain metallic strips

机译:半导体器件,包括交替的源极和漏极区域以及各自的源极和漏极金属条

摘要

A semiconductor device and method of forming the same including, in one embodiment, a substrate and a plurality of source and drain regions formed as alternating pattern on the substrate. The semiconductor device also includes a plurality of gates formed over the substrate between and parallel to ones of the plurality of source and drain regions. The semiconductor device also includes a first plurality of alternating source and drain metallic strips formed in a first metallic layer above the substrate and parallel to and forming an electrical contact with respective ones of the plurality of source and drain regions.
机译:一种半导体器件及其形成方法,在一个实施例中,包括衬底以及在该衬底上形成为交替图案的多个源极和漏极区域。半导体器件还包括在多个源极区和漏极区中的一个之间并与之平行的多个栅极。半导体器件还包括第一多个交替的源极和漏极金属带,该第一多个交替的源极和漏极金属带形成在衬底上方的第一金属层中,并与多个源极和漏极区域中的各个源极区域和与之形成电接触。

著录项

  • 公开/公告号US9299691B2

    专利类型

  • 公开/公告日2016-03-29

    原文格式PDF

  • 申请/专利权人 ENPIRION INC.;

    申请/专利号US201314091739

  • 申请日2013-11-27

  • 分类号H01L29/06;H01L27/02;H01L23/522;H01L29/417;H01L29/66;H01L27/092;H01L27/088;H01L21/8234;H01L21/8238;H01L25;H01L27/06;H01L23/482;H01L23/36;H01L23/495;H01L29/78;H01L23/31;H01L23/64;H01L23;H01L29/45;H01L29/49;H01L29/08;H01L29/10;H01L21/768;H01L21/285;

  • 国家 US

  • 入库时间 2022-08-21 14:28:59

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