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Methods of forming group III-V semiconductor materials on group IV substrates and the resulting substrate structures
Methods of forming group III-V semiconductor materials on group IV substrates and the resulting substrate structures
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机译:在第IV族衬底上形成III-V族半导体材料的方法以及所得的衬底结构
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摘要
One method disclosed herein includes forming a patterned mask layer above a surface of a semiconductor substrate, performing at least one etching process through the patterned mask layer to define a plurality of intersecting ridges that define a ridged surface in the substrate, and forming a Group III-V material on the ridged surface of the substrate. An illustrative device disclosed herein includes a Group IV substrate having a ridged surface comprised of a plurality of intersecting ridges and a Group III-V material layer positioned on the ridged surface of the Group IV substrate.
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