首页> 外国专利> Method for fabricating a cavity structure, for fabricating a cavity structure for a semiconductor structure and a semiconductor microphone fabricated by the same

Method for fabricating a cavity structure, for fabricating a cavity structure for a semiconductor structure and a semiconductor microphone fabricated by the same

机译:空腔结构的制造方法,半导体结构的空腔结构和由该空腔结构制造的半导体麦克风

摘要

Embodiments show a method for fabricating a cavity structure, a semiconductor structure, a cavity structure for a semiconductor device and a semiconductor microphone fabricated by the same. In some embodiments the method for fabricating a cavity structure comprises providing a first layer, depositing a carbon layer on the first layer, covering at least partially the carbon layer with a second layer to define the cavity structure, removing by means of dry etching the carbon layer between the first and second layer so that the cavity structure is formed.
机译:实施例示出了用于制造空腔结构的方法,半导体结构,用于半导体器件的空腔结构以及由其制造的半导体麦克风。在一些实施例中,用于制造空腔结构的方法包括:提供第一层,在第一层上沉积碳层,用第二层至少部分覆盖碳层以限定空腔结构,并通过干蚀刻去除碳。在第一和第二层之间形成层,从而形成腔结构。

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