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Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate

机译:用于在柔性基板上组装电子部件以及将电子部件与柔性基板组装的方法和设备

摘要

A method is presented for assembling a component (30) with a flexible substrate (10), the component having electric contacts (31). The method comprises the steps ofplacing the component (30) on a first main side (11) of the substrate,applying a machine vision step to estimate a position of the electric contacts,depositing one or more layers (32) of an electrically conductive material or a precursor thereof, said layer extending over an area of the substrate defined by the component to laterally beyond said area,calculating partitioning lines depending on the estimated position of the electric contacts,partitioning the layer into mutually insulated areas (32d) by locally removing material from said layer along said partitioning lines.;Also an apparatus is presented that is suitable for carrying out the method.;In addition an assembly is present that can be obtained by the method and the apparatus according to the invention.
机译:提出了一种用于将组件( 30 )与柔性基板( 10 )组装在一起的方法,该组件具有电触点( 31 )。该方法包括以下步骤: 将组件( 30 )放置在基板的第一主侧面( 11 )上 应用机器视觉步骤来估计电触点的位置, 沉积一层或多层( 32 )的导电材料或其前体,所述层在由组件定义的基板区域上延伸,并横向超出该区域。 根据电触点的估计位置计算分隔线, 将层划分为相互绝缘的区域( 32 d ),方法是沿着分隔线从该层中局部移除材料。 ;还提出了一种适于执行该方法的设备。此外,存在一种可以通过该方法和根据本发明的设备获得的组件。 。

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