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Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor package
Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor package
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机译:屏蔽件,封装结构和具有该屏蔽件的半导体封装件以及该半导体封装件的制造方法
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摘要
A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a substrate having at least a carrying region and a cutting region defined on a surface thereof, wherein the cutting region surrounds the carrying region; disposing at least an electronic element on the carrying region of the substrate; disposing a shield having a recess portion and at least a positioning member extending outwards, on the carrying region of the substrate with the electronic element received in the recess portion and the positioning member extending outwards to the cutting region; and performing a cutting process along the cutting region to remove portions of the positioning member and the substrate. Therefore, the shield is precisely positioned on the substrate.
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