microelectronics unit, microelectronics assembly, microelectronics manufacturing methods, and systems.

摘要

microelectronics unit, microelectronics assembly, methods of manufacturing a microelectronics unit and manufacturing a stacked array of microelectronics units, and system. A microelectronics unit is disclosed which includes a support structure with a front surface, a rear surface remote from the front surface, and a recess with an opening in the front surface and an inner surface located below the front surface of the support structure. The microelectronic unit may include a microelectronic element with a base surface adjacent the inner surface, a remote top surface relative to the base surface, and a plurality of contacts on the top surface. The microelectronic element may include terminals electrically connected to the contacts of the microelectronic element. The microelectronic unit may include a dielectric region that contacts at least the top surface of the microelectronic element. the dielectric region may have a flat surface located plane above or above the front surface of the support structure. terminals may be exposed on the surface of the dielectric region for interconnection with an external element.