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ULTRA LOW LEAKAGE SRAM CELL

机译:超低泄漏SRAM单元

摘要

ABSTRACT An ultra low leakage SRAM Cell is disclosed at the 65nm node. Process and circuit techniques are used together to achieve extremely low leakage in standby mode while still maintaining the high read current in active mode. We demonstrate an ultra low ISB of 0.52pA/cell in the standby retention mode and a simultaneous read current of 17.5uA/cell. The 4-way halo is replaced by a 2-way halo for the Cell FETs to minimize GIDL which is found to be the dominant component of overall leakage. In addition, circ uit techniques such as source biasing are used to achieve ultra low leakage without trading off too much on the access time and Static Noise Margin across all operating temperatures. Due to the above modifications this special cell, which is unique in the indu stry, is able to work as a dual mode cell capable of both fast Async as well as MoBL operation. This enables Cypress to get enhanced yield for its Asynchronous memory products in 65nm. The learning from this will also be extended to the 55nm node (for S55 platform) which will give us an additional 20% saving in SRAM cell area.
机译:摘要在65nm节点处公开了一种超低泄漏SRAM单元。工艺和电路技术一起使用可在待机模式下实现极低的泄漏,同时在活动模式下仍保持高读取电流。我们证明了在待机保持模式下ISB为0.52pA / cell的超低ISB,同时读取电流为17.5uA / cell。 Cell FET的4通光环被2通光环取代,以使GIDL最小,而GIDL被认为是总泄漏的主要成分。此外,诸如源极偏置之类的电路技术可用于实现超低泄漏,而不会在所有工作温度范围内权衡访问时间和静态噪声裕度。由于上述修改,该特殊单元在行业中是独一无二的,能够作为双模式单元工作,能够同时进行快速异步和MoBL操作。这使赛普拉斯可以提高其65nm异步存储产品的良率。从中学到的知识也将扩展到55nm节点(用于S55平台),这将使我们在SRAM单元面积上节省额外的20%。

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