IMAGE INSPECTION DEVICE, AND IMAGE INSPECTION METHOD USING THE IMAGE INSPECTION DEVICE

摘要

In an inspection of a semiconductor wafer for a defect, when infrared light passing through a semiconductor wafer is imaged by a camera and an inspection is conducted using the image, the problem that halation occurs in the camera due to light leaking from the side of the inspection object, which makes it impossible to conduct an inspection at the periphery portion occurs. An inspection object is irradiated by an infrared light source, and transmitted light is imaged by an infrared camera. With the use of mask means that secures a clearance from the end portion on the outer side, it is possible to inspect the peripheral portion. Also, as means for supporting the object, plural sets of support means capable of being moved up to a position not to cover the object are used, and by allowing the plural sets to move alternately, it is possible to inspect across the entire surface.