首页> 外国专利> METHOD OF LASER CUTTING A SAPPHIRE SUBSTRATE BY LASERS AND AN ARTICLE COMPRISING SAPPHIRE WITH EDGE HAVING A SERIES OF DEFECTS

METHOD OF LASER CUTTING A SAPPHIRE SUBSTRATE BY LASERS AND AN ARTICLE COMPRISING SAPPHIRE WITH EDGE HAVING A SERIES OF DEFECTS

机译:用激光切割蓝宝石基质的方法以及包含有一系列缺陷的带有边缘的蓝宝石的制品

摘要

A method of laser processing a material to form a separated part is described, with also an article comprising sapphire. The method includes focusing a pulsed laser beam (2a) into a laser beam focal line (2b), viewed along the beam propagation direction, directed into the material (1), the laser beam focal line (7) generating an induced absorption within the material (1), the induced absorption producing a hole or fault line along the laser beam focal line (2b) within the material (1), and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material (1) over the plurality of holes to a proximal edge of the material (1).
机译:描述了一种激光加工材料以形成分离部分的方法,并且还提供了一种包括蓝宝石的制品。该方法包括:沿光束传播方向观察,将脉冲激光束(2a)聚焦到激光束焦点线(2b)中,该激光束焦点线(2b)定向到材料(1)中,该激光束焦点线(7)在光束的内部产生感应吸收。材料(1)的感应吸收沿材料(1)内的激光束聚焦线(2b)产生孔或断层线,并从材料(1)的远端引导散焦的二氧化碳(CO2)激光在多个孔上覆盖材料(1)的近端边缘。

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