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FLEXIBLE ENCAPSULATION MATERIAL FOR ENCAPSULATING ORGANIC ELECTRONIC ELEMENT, ORGANIC ELECTRONIC ELEMENT ENCAPSULATED BY SAME, AND METHOD FOR ENCAPSULATING ORGANIC ELECTRONIC ELEMENT
FLEXIBLE ENCAPSULATION MATERIAL FOR ENCAPSULATING ORGANIC ELECTRONIC ELEMENT, ORGANIC ELECTRONIC ELEMENT ENCAPSULATED BY SAME, AND METHOD FOR ENCAPSULATING ORGANIC ELECTRONIC ELEMENT
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机译:用于封装有机电子元件的柔性封装材料,由相同封装的有机电子元件以及用于封装有机电子元件的方法
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摘要
The present invention relates to a flexible encapsulation material for encapsulating an organic electronic element, an organic electronic element encapsulated by the flexible encapsulation material, and a method for encapsulating the organic electronic element. According to the present invention, a flexible encapsulation material capable of efficiently lengthening the service life of an organic electronic element can be provided while using a roll-to-roll process, which is suitable for mass production of the organic electronic element.
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