A light-cured thermosetting resin composition, a dry film, a cured material, and a printed circuit board. The light-cured thermosetting resin composition comprises: (A) a carboxyl-containing resin, (B) a photopolymerization initiator, (C) a photosensitive monomer, (D) a thermosetting component, and (E) titanium oxide. The (A) carboxyl-containing resin comprises (A-1) a bisphenol-type carboxyl-containing resin and (A-2) a novolac-type carboxyl-containing resin, wherein the mass ratio of the (A-1) bisphenol-type carboxyl-containing resin to the (A-2) novolac-type carboxyl-containing resin (the (A-1) bisphenol-type carboxyl-containing resin:the (A-2) novolac-type carboxyl-containing resin) is in the range of 20:80-60:40.
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