LIGHT-CURED THERMOSETTING RESIN COMPOSITION DRY FILM CURED MATERIAL AND PRINTED CIRCUIT BOARD

摘要

The present invention provides a photocurable thermosetting resin composition, a dry film, a cured product and a printed wiring board. The photocurable thermosetting resin composition contains (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a photosensitive monomer, (D) a thermosetting component and (E) titanium oxide. (A-1) a bisphenol-type carboxyl group-containing resin and (A-2) a novolac-type carboxyl group-containing resin, wherein the (A- 2) the mass ratio of the novolac-type carboxyl group-containing resin (the (A-1) bisphenol-type carboxyl group-containing resin: the (A-2) novolak-type carboxyl group-containing resin) is in the range of 20:80 to 60:40.