HIGH-MOLECULAR-WEIGHT COMPOUND, SURFACE-TREATING AGENT, LAYERED PRODUCT OBTAINED USING SURFACE-TREATING AGENT, TRANSISTOR, AND PROCESS FOR PRODUCING LAYERED PRODUCT

摘要

Provided is a compound which is excellent in terms of stability and tight adhesion to substrates and on which wiring can be formed by electroless plating.The compound is a high-molecular-weight compound having a constituent unit represented by the following formula (1).[In formula (1), R¹ represents a hydrogen atom or a methyl group, m is an integer of 2-20, and Q represents a photosensitive leaving group.]