SEMICONDUCTOR DIE PICKUP APPARATUS AND SEMICONDUCTOR DIE PICKUP METHOD

摘要

A stage 20 including a suction surface 22 for suctioning the dicing sheet 12, a suction opening 40 provided on the suction surface 22 of the stage 20, A lid 23 for opening and closing the suction opening 40 and a lid 23 for switching the pressure of the suction opening 40 between the first pressure P ₁ close to the vacuum and the second pressure P ₂ close to the atmospheric pressure Each time the semiconductor die 15 is picked up and the pressure of the suction opening 40 is switched from the first pressure P ₁ to the second pressure P ₂ , Is slid in the opening direction by a predetermined distance. As a result, damage to the semiconductor die is suppressed and the semiconductor die is effectively picked up.