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COPPER ALLOY PLATE, AND ELECTRONIC COMPONENT FOR LARGE CURRENT APPLICATIONS AND ELECTRONIC COMPONENT FOR HEAT DISSIPATION APPLICATIONS EACH PROVIDED WITH SAME
COPPER ALLOY PLATE, AND ELECTRONIC COMPONENT FOR LARGE CURRENT APPLICATIONS AND ELECTRONIC COMPONENT FOR HEAT DISSIPATION APPLICATIONS EACH PROVIDED WITH SAME
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机译:铜合金板和用于大电流应用的电子部件以及用于散热应用的电子部件
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摘要
The copper alloy sheet of the present invention contains 0.01 to 0.50 mass% of at least one of Zr and Ti in total, the balance copper and inevitable impurities, and has an electrical conductivity of 70% IACS or more and a mechanical strength of 0.2 %, And the 0.2% proof stress σ (MPa) and the elongation percentage L (%) satisfy the relationship of σ / L ≤ 150.
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