ASH-FREE CYCLIC ORGANIC POLYOL, REACTIVE POROGENS USING THE ASH-FREE CYCLIC ORGANIC POLYOL, AND NANOPOROUS ULTRA LOW DIELECTRIC FILM BY USING THE SAME

摘要

The present disclosure relates to a reactive porogen using cyclic organic polyol and an ultra low dielectric film prepared using the same, and more particularly, to novel cyclic organic polyol as a cyclic organic polyol compound which can be completely pyrolyzed at a temperature of 500° C. or less, does not leave carbon residue during a heat treatment if an end hydroxyl group of the cyclic organic compound is substituted by a functional group of alkylalkoxysilane and then used as a reactive porogen, and is involved in a sol-gel reaction of organic silicate and suppresses phase separation and thus forms pores having a uniform size and has excellent mechanical properties as compared with a porosity, a reactive porogen using the ash-free cyclic organic polyol, and an ultra low dielectric film prepared using the same.