WAFER AND LOT BASED HIERARCHICAL METHOD COMBINING CUSTOMIZED METRICS WITH A GLOBAL CLASSIFICATION METHODOLOGY TO MONITOR PROCESS TOOL CONDITION AT EXTREMELY HIGH THROUGHPUT

摘要

A method and system for monitoring process tool status is disclosed. The method may be applied to a single wafer, a plurality of wafers in a single lot, and a plurality of lot information, as input to a conventional classification engine capable of consuming a single or multiple scans, channels, wafers, and lots to determine process tool status. .