PRE-TREATMENT PROCESS FOR ELECTROLESS NICKEL PLATING

摘要

The present invention discloses a method of electroless nickel plating on the copper material of the printed circuit board for suppressing the unnecessary nickel plating. The method comprises the steps of: i) activating a copper material of a palladium ion; ii) an excess of a palladium ion, or a two or more different types of the acid a precipitate formed (In this case, one type of pre-treatment steps for removing a composition comprising an organic amino carboxylic sanim); And iii) electroless nickel plating step. ;