ALLOY solder based on palladium 850 SAMPLE

摘要

Solder alloy based on palladium sample 850 containing copper and boron, characterized in that it contains copper and boron in a ratio of 3.0-3.7 copper to boron, boron but not more than 3.6 wt. %, Palladium - 85,0-85,5 wt. %.