SOLDER ALLOY BASED ON PALLADIUM 850 ALLOY

摘要

FIELD: metallurgy.;SUBSTANCE: solder alloy is composed of palladium 850 alloy. It contains silicon and silver at the following ration of components, wt %: palladium - 85.0-85.5, silicon - 2.5-4.1, silver making the rest.;EFFECT: low fusion point, good plastic deformation capacity.;2 tbl