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A method of manufacturing flexible loops for microassemblies

机译:一种用于微组件的柔性环的制造方法

摘要

A method of manufacturing flexible loops for microassemblies, including the preliminary manufacture of layered components of loops with conductors deposited on them, characterized in that initially they take the first set of a given number of basic components of a flexible loop on a single base in the form of a preform of a polyimide film coated with a layer of aluminum foil , form on it a given conductive circuit, for which a series of through longitudinal slots is performed by laser cutting, after which the polyimide layer is removed by chemical etching, then they take a second set of compatible components of the flexible loop in the form of a polyimide film with a fluoroplastic layer deposited, on which the windows for contact pads having a transverse orientation are formed by laser cutting, followed by combining the corresponding components of the first and second sets by a group method in such a way so that the contact pad windows of the compatible components of the flexible cable coincide with the edge sections of the conductors of the basic components of the flexible cable, obtained Many sets are connected by thermocompression welding at a temperature in the range 327-335 ° C to obtain an assembly of a group of flexible loops on a single base, then this assembly is divided into individual products by laser cutting.
机译:一种制造用于微组件的柔性环的方法,包括初步制造其上沉积有导体的环的分层组件,其特征在于,最初,它们在给定的单个基座上采用第一组给定数量的柔性环的基本组件。涂覆有一层铝箔的聚酰亚胺薄膜的预成型件的形式,在其上形成给定的导电电路,为此,通过激光切割执行一系列贯穿的纵向槽,然后通过化学蚀刻去除聚酰亚胺层,然后他们采用了沉积有氟塑料层的聚酰亚胺薄膜形式的柔性套环的第二组兼容组件,在其上通过激光切割形成具有横向取向的接触垫的窗口,然后将其对应的组件组合在一起。第一组和第二组采用分组方法,以使软电缆兼容组件的接触垫窗口与软电缆的基本组件的导体的边缘部分相吻合,获得许多组,通过在327-335°C的温度范围内进行热压焊接连接,以在单个基座上获得一组柔性回路的组合,然后将该组件通过激光切割分为单个产品。

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