Method for producing metal layers of homogeneous thickness on printed circuit boards with plated-through holes and a treatment device intended for carrying out the method

摘要

The invention relates to a method for producing homogeneous metal layers on a carrier material (1) having a multiplicity of perforations (2). In order to achieve a virtually uniform layer structure of constant layer thickness both in the region of the perforations (2) and in the remaining regions of the carrier material (1), a flow of the electrolyte acting on the carrier material (1) is produced in the treatment basin. For this purpose, adjacent to the surface of the carrier material (1) on which the metal deposition is to take place, at least one flow guide element (4) moves translationally reversing together with the carrier material (1) in the treatment basin. The flow guide (4) has a plurality of regularly arranged passage openings (5) of the same size and is arranged in the treatment tank parallel spaced from the carrier material (1). In this way, a flow (6) with a directional component (7) is generated parallel to the surface of the carrier material (1).