Method for monitoring the operating state of a surface - inspection system for the detection of defects on the surface of semiconductor wafers

摘要

Method for monitoring the operating state of a surface - inspection system for the detection of defects on surfaces of semiconductor wafers, comprisingthe provision of a reference - semiconductor wafer with defects of a certain number and size and density on a separated of the reference - semiconductor wafer;the passage of a reference - inspection of the reference - semiconductor wafer and at least one control - inspection of the reference - semiconductor wafer with the use of the surfaces - inspection system, wherein position and size of the defects on the separated be measured;the identifying defective, which, due to their position as a common defects of the reference - inspection and the control - inspection are considered;for each joint defect in the determination of a variables difference, which results from the comparison of its size based on the reference - inspection and the control - inspection; andthe result of the operating state of the surfaces - inspection system on the basis of the determined size differences.