首页> 外国专利> Method for monitoring the operating state of a surface - inspection system for the detection of defects on the surface of semiconductor wafers

Method for monitoring the operating state of a surface - inspection system for the detection of defects on the surface of semiconductor wafers

机译:监视表面检查系统工作状态的方法-用于检测半导体晶片表面上的缺陷

摘要

Method for monitoring the operating state of a surface - inspection system for the detection of defects on surfaces of semiconductor wafers, comprisingthe provision of a reference - semiconductor wafer with defects of a certain number and size and density on a separated of the reference - semiconductor wafer;the passage of a reference - inspection of the reference - semiconductor wafer and at least one control - inspection of the reference - semiconductor wafer with the use of the surfaces - inspection system, wherein position and size of the defects on the separated be measured;the identifying defective, which, due to their position as a common defects of the reference - inspection and the control - inspection are considered;for each joint defect in the determination of a variables difference, which results from the comparison of its size based on the reference - inspection and the control - inspection; andthe result of the operating state of the surfaces - inspection system on the basis of the determined size differences.
机译:监测表面的工作状态的方法-用于检测半导体晶片表面上的缺陷的检查系统,包括提供参考-在分离的参考半导体晶片上具有一定数量,尺寸和密度的缺陷的半导体晶片基准的通过-基准的检查-半导体晶片和至少一个控制-基准的检查-使用表面检查的半导体晶片-检查系统,其中测量分离出的缺陷的位置和大小;识别缺陷,由于其作为参考-检查和对照-检查的常见缺陷的位置而被考虑;对于每个关节缺陷,在确定变量差异时,这是根据其尺寸的比较得出的参考-检查和控制-检查;以及表面工作状态的结果-基于确定的尺寸差异的检查系统。

著录项

  • 公开/公告号DE102014215727B4

    专利类型

  • 公开/公告日2016-06-09

    原文格式PDF

  • 申请/专利权人 SILTRONIC AG;

    申请/专利号DE201410215727

  • 发明设计人 FRANK LAUBE;

    申请日2014-08-08

  • 分类号G01N21/95;H01L21/66;G01N21/93;

  • 国家 DE

  • 入库时间 2022-08-21 14:09:52

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号