Three-dimensional system-in-package metal circuit board structure for first encapsulated and later etched normal chips and methods of processing same

摘要

The present invention relates to a three-dimensional on-chip metal circuit board structure for first-packaged and later-etched normal chips and a processing method for manufacturing the same, the structure comprising: a metal substrate frame (1); a lead (3) provided in the metal substrate frame (1); a conductive pillar (4) provided on an upper surface of the lead (3); a chip (5) normally attached to an upper surface of the metal substrate frame (1) or between the leads (3); a metal wire (6) via which an upper surface of the chip (5) is connected to an upper surface of the lead (3); a molding material (8) with which a peripheral region of the lead (3), the conductive pillar (4), the chip (5) and the metal wire (6) is encapsulated, the molding material (8) being connected to an upper side of the conductive pillar (8) 4) is flush.