SPRINGBACK OCCURRENCE CAUSE ANALYZING METHOD, SPRINGBACK OCCURRENCE CAUSE ANALYZING DEVICE, SPRINGBACK OCCURRENCE CAUSE ANALYZING PROGRAM, AND RECORDING MEDIUM

摘要

A method of analyzing a cause of springback of the invention includes: performing a forming analysis to calculate forming data of a formed product; decomposing a component into an in-plane stress component and a bending moment component; generating a before-calculation individual decomposition forming data; performing a calculation to generate an after-calculation individual decomposition forming data; analyzing a first springback configuration and a second springback configuration; obtaining a degree of influence of a stress in each of the areas with respect to springback deformation; and displaying the degree of influence with respect to the springback deformation.