首页> 外国专利> SPRINGBACK OCCURRENCE CAUSE ANALYZING METHOD, SPRINGBACK OCCURRENCE CAUSE ANALYZING DEVICE, COMPUTER READABLE RECORDING MEDIUM FOR RECORDING SPRINGBACK OCCURRENCE CAUSE ANALYZING PROGRAM

SPRINGBACK OCCURRENCE CAUSE ANALYZING METHOD, SPRINGBACK OCCURRENCE CAUSE ANALYZING DEVICE, COMPUTER READABLE RECORDING MEDIUM FOR RECORDING SPRINGBACK OCCURRENCE CAUSE ANALYZING PROGRAM

机译:回弹率原因分析方法,回弹率原因分析设备,用于记录回弹率原因的计算机可读记录介质分析程序

摘要

A method of analyzing a cause of springback of the invention includes: performing a forming analysis to calculate forming data of a formed product; decomposing a component into an in-plane stress component and a bending moment component; generating a before-calculation individual decomposition forming data; performing a calculation to generate an after-calculation individual decomposition forming data; analyzing a first springback configuration and a second springback configuration; obtaining a degree of influence of a stress in each of the areas with respect to springback deformation; and displaying the degree of influence with respect to the springback deformation.
机译:分析本发明的回弹原因的方法包括:进行成形分析以计算成形产品的成形数据;以及进行成形分析。将分量分解为面内应力分量和弯矩分量;生成计算前的个体分解形成数据;执行计算以产生计算后的个体分解形成数据;分析第一回弹配置和第二回弹配置;获得关于回弹变形的每个区域中的应力的影响程度;并显示对回弹变形的影响程度。

著录项

  • 公开/公告号KR101368108B1

    专利类型

  • 公开/公告日2014-02-27

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20117014506

  • 申请日2009-06-24

  • 分类号G06F19;G06F17/50;B21D22;G06Q50/04;

  • 国家 KR

  • 入库时间 2022-08-21 15:41:26

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