首页> 外国专利> ALUMINUM ALLOY MATERIAL, SINGLE LAYER OF WHICH ALLOWS THERMAL BONDING; MANUFACTURING METHOD THEREFOR; AND ALUMINUM BONDED BODY USING SAID ALUMINUM ALLOY MATERIAL

ALUMINUM ALLOY MATERIAL, SINGLE LAYER OF WHICH ALLOWS THERMAL BONDING; MANUFACTURING METHOD THEREFOR; AND ALUMINUM BONDED BODY USING SAID ALUMINUM ALLOY MATERIAL

机译:铝合金材料,允许热粘结的单层;制造方法铝合金材料的铝和铝结合体

摘要

This invention provides an aluminum alloy material capable of being thermally bonded in a single layer without using a bonding agent, such as a brazing or welding filler metal. This invention also provides a bonding method for the aluminum alloy material, and an aluminum bonded body using the aluminum alloy material. The aluminum alloy material is made of an aluminum alloy containing Si: 1.0 to 5.0 mass% and Fe: 0.01 to 2.0 mass% with the balance Al and inevitable impurities. The aluminum alloy material contains 10 to 1 × 10 4 pieces/µm 3 of Al-based intermetallic compounds having equivalent circle diameters of 0.01 to 0.5 µm and 200pieces/mm 2 or less of Si-based intermetallic compounds having equivalent circle diameters of 5.0 to 10 µm.
机译:本发明提供了一种铝合金材料,该铝合金材料能够在不使用诸如钎焊或焊接填充金属之类的粘合剂的情况下以单层热粘合。本发明还提供铝合金材料的接合方法以及使用该铝合金材料的铝接合体。铝合金材料由含有Si:1.0〜5.0质量%,Fe:0.01〜2.0质量%,余量为Al,不可避免的杂质的铝合金构成。该铝合金材料包含10至1×10 4个/μm3的当量圆直径为0.01至0.5μm的Al基金属间化合物和200个/ mm 2以下的Si基的金属间化合物的等效圆直径为5.0至0.5μm。 10微米

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