PROCESS OF MANUFACTURING ELECTRONIC MODULES WITH CONNECTION OF A METALLIC COMPONENT TO A CERAMIC SURFACE OF A SUBSTRATE USING A METAL POWDER-BASED PASTE

摘要

A method, comprising: providing at least one substrate (210) having a ceramic surface (220), a printable metal powder based paste (230), and a metallic component (240); Applying a layer consisting of the paste (230) to a portion of the surface (220) and / or the component (240); Placing the component (240) on the ceramic surface (220) with said layer (230) interposed therebetween; Pressing the component (240) into the layer (230); Drying the paste (230) at a temperature adapted in such a way that, on the one hand, the diluents of the paste (230) evaporate and, on the other hand, do not burn the organic constituents of the paste (230); and sintering the paste (230) at a temperature below the respective lower melting temperature of the two components (210, 240) to be sintered, to form an electrically and thermally conductive layer with surface and material connection to the metallic component (240) and to the surface ( 220). The ceramic surface (220) of the substrate (210) may be an oxide ceramic and the at least one metallic component (240) may be copper, wherein the sintering is in a predominantly inert atmosphere. The metallic component (240) can be structured and / or mechanically deformed, the metallic component (240) electrically connecting at least two regions of the ceramic surface (220) and / or a metallic surface of a second metallic component. In addition, a printable, non-metal powder-based paste or additionally a printable, metal powder-based paste in one or more layers on the printable, metal powder-based paste (230) can be applied one above the other. A second metallic component can be placed and pressed onto a printable, non-metal powder-based or metal-powder-based paste applied to the first metallic component (240). The substrate (210) may also be a metal-ceramic composite.