AU-SN-AG SOLDER ALLOY AND SOLDER MATERIAL, ELECTRONIC COMPONENT SEALED USING SAID SOLDER ALLOY OR SOLDER MATERIAL, AND MOUNTED-ELECTRONIC COMPONENT DEVICE

摘要

[Object] To provide an Au-Ag-Sn-based solder alloy for high temperature use that is so good at reflow wettability as to be sufficiently usable in reflow bonding of crystal quartz devices, SAW filters and MEMS, wherein, in particular, the solder alloy costs low and is excellent in solderability, reflow wettability and reliability.;[Measures for Solution] An Au-Sn-Ag-based solder alloy containing Sn, Ag, Au and elements that are inevitably contained owing to manufacture procedure, characterized by having a composition adjusted so that a solidus temperature is within a range of 280-400°C with a gap between the solidus temperature and the liquidus temperature being within 40°C.