COMBINED METHOD FOR PRODUCING SOLIDS, INVOLVING LASER TREATMENT AND TEMPERATURE-INDUCED STRESSES TO GENERATE THREE-DIMENSIONAL SOLIDS

摘要

The present invention relates to a method for producing at least one three-dimensional solid layer (4), in particular for use as a wafer, and/or at least one three-dimensional solid (40). The method according to the invention preferably comprises the following steps: providing a workpiece (2) for detaching the solid layers (4) and/or the solids (40), wherein the workpiece (2) has at least one exposed surface, generating defects (34) within the workpiece (2), wherein the defects (34) define at least one crack-conducting layer (8), wherein the crack-conducting layer (8) describes at least one three-dimensional contour, applying or generating a receiving layer (10) on the exposed surface of the workpiece (2), thereby forming a composite structure, tempering the receiving layer to generate stresses within the workpiece (2), wherein the stresses give rise to crack propagation within the workpiece (2), wherein, as a result of the crack propagation, a three-dimensional solid layer (4) or a three-dimensional solid (40) is separated from the workpiece (2) along the crack-conducting layer (8), wherein a surface of the solid layer (4) or of the solid corresponds to the three-dimensional contour of the crack-conducting layer (8).