COMBINED METHOD FOR PRODUCING SOLIDS, INVOLVING LASER TREATMENT AND TEMPERATUREINDUCED STRESSES TO GENERATE THREE-DIMENSIONAL SOLIDS

摘要

The present invention relates to a method for the production of at least one three-dimensional layer of solid material, in particular for usage as wafer, and/or at least one tree-dimensional solid body. The inventive method preferably comprises the following steps:Providing a work piece for removing of layers of solid material and/or the solid bodies, wherein the work piece comprises at least one exposed surface,generating defects inside the work piece,wherein the defects define at least one crack directing layer,wherein the crack directing layer describes at least one three-dimensional contour;attaching or generating a receiving layer at the exposed surface of work piece by forming a composite structure,thermal treating of the receiving layer for generating stresses inside the work piece, wherein the stresses are causing a crack propagation inside the work piece,wherein a layer of solid material or a three-dimensional solid body is separated along the crack directing layer due to the crack propagation, wherein a surface of the layer of solid material or a surface of the solid body corresponds to the three-dimensional contour of the crack directing layer.