SURFACE TREATMENT METHOD OF PLACING TABLE, PLACING TABLE AND PLASMA PROCESSING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a technique for stabilizing plasma in a processing container, in a plasma processing apparatus applying a high frequency power between an upper electrode and a metal placing table also serving as the lower electrode.SOLUTION: Following to first blast processing for blowing fine particles 100 of alumina to the placing surface of a metal placing table 3 provided in a processing container 2 and also serving as a lower electrode, second blast processing for blowing fine particles 101 of dry ice is performed. Consequently, irregular corners formed by blowing fine particles 100 of alumina are rounded. Impedance between a wafer W and the placing table 3 is reduced in a high frequency current path from a high frequency power supply 51 via a gas supply section 5 (upper electrode), a wafer W and the placing table 3 to the earth. Since formation of a current path from the plasma generation region toward the sidewall of processing container 2 is suppressed, the plasma is stabilized and stabilized plasma processing can be carried out.SELECTED DRAWING: Figure 2